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PCB專業(yè)術(shù)語(yǔ)

2013/01/25

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PCB專業(yè)英譯術(shù)語(yǔ)
一、綜合詞匯
1、印制電路：printed circuit
2、印制線路：printed wiring
3、印制板：printed board
4、印制板電路：printed circuit board (PCB)
5、印制線路板：printed wiring board(PWB)
6、印制組件：printed component
7、印制接點(diǎn)：printed contact
8、印制板裝配：printed board assembly
9、板：board
10、單面印制板：single-sided printed board(SSB)
11、雙面印制板：double-sided printed board(DSB)
12、多層印制板：mulitlayer printed board(MLB)
13、多層印制電路板：mulitlayer printed circuit board
14、多層印制線路板：mulitlayer prited wiring board
15、剛性印制板：rigid printed board
16、剛性單面印制板：rigid single-sided printed borad
17、剛性雙面印制板：rigid double-sided printed borad
18、剛性多層印制板：rigid multilayer printed board
19、撓性多層印制板：flexible multilayer printed board
20、撓性印制板：flexible printed board
21、撓性單面印制板：flexible single-sided printed board
22、撓性雙面印制板：flexible double-sided printed board
23、撓性印制電路：flexible printed circuit (FPC)
24、撓性印制線路：flexible printed wiring
25、剛性印制板：flex-rigid printed board, rigid-flex printed board
26、剛性雙面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
27、剛性多層印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
28、齊平印制板：flush printed board
29、金屬芯印制板：metal core printed board
30、金屬基印制板：metal base printed board
31、多重布線印制板：mulit-wiring printed board
32、陶瓷印制板：ceramic substrate printed board
33、導(dǎo)電膠印制板：electroconductive paste printed board
34、模塑電路板：molded circuit board
35、模壓印制板：stamped printed wiring board
36、順序?qū)訅憾鄬佑≈瓢澹簊equentially-laminated mulitlayer
37、散線印制板：discrete wiring board
38、微線印制板：micro wire board
39、積層印制板：buile-up printed board
40、積層多層印制板：build-up mulitlayer printed board (BUM)
41、積層撓印制板：build-up flexible printed board
42、表面層合電路板：surface laminar circuit (SLC)
43、埋入凸塊連印制板：B2it printed board
44、多層膜基板：multi-layered film substrate(MFS)
45、層間全內(nèi)導(dǎo)通多層印制板：ALIVH multilayer printed board
46、載芯片板：chip on board (COB)
47、埋電阻板：buried resistance board
48、母板：mother board
49、子板：daughter board
50、背板：backplane
51、裸板：bare board
52、鍵盤板夾心板：copper-invar-copper board
53、動(dòng)態(tài)撓性板：dynamic flex board
54、靜態(tài)撓性板：static flex board
55、可斷拼板：break-away planel
56、電纜：cable
57、撓性扁平電纜：flexible flat cable (FFC)
58、薄膜開(kāi)關(guān)：membrane switch
59、混合電路：hybrid circuit
60、厚膜：thick film
61、厚膜電路：thick film circuit
62、薄膜：thin film
63、薄膜混合電路：thin film hybrid circuit
64、互連：interconnection
65、導(dǎo)線：conductor trace line
66、齊平導(dǎo)線：flush conductor
67、傳輸線：transmission line
68、跨交：crossover
69、板邊插頭：edge-board contact
70、增強(qiáng)板：stiffener
71、基底：substrate
72、基板面：real estate
73、導(dǎo)線面：conductor side
74、組件面：component side
75、焊接面：solder side
76、印制：printing
77、網(wǎng)格：grid
78、圖形：pattern
79、導(dǎo)電圖形：conductive pattern
80、非導(dǎo)電圖形：non-conductive pattern
81、字符：legend
82、標(biāo)志：mark
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作者：ilww 2004-11-10 16:18:00)

二、基材：
1、基材：base material
2、層壓板：laminate
3、覆金屬箔基材：metal-clad bade material
4、覆銅箔層壓板：copper-clad laminate (CCL)
5、單面覆銅箔層壓板：single-sided copper-clad laminate
6、雙面覆銅箔層壓板：double-sided copper-clad laminate
7、復(fù)合層壓板：composite laminate
8、薄層壓板：thin laminate
9、金屬芯覆銅箔層壓板：metal core copper-clad laminate
10、金屬基覆銅層壓板：metal base copper-clad laminate
11、撓性覆銅箔絕緣薄膜：flexible copper-clad dielectric film
12、基體材料：basis material
13、預(yù)浸材料：prepreg
14、粘結(jié)片：bonding sheet
15、預(yù)浸粘結(jié)片：preimpregnated bonding sheer
16、環(huán)氧玻璃基板：epoxy glass substrate
17、加成法用層壓板：laminate for additive process
18、預(yù)制內(nèi)層覆箔板：mass lamination panel
19、內(nèi)層芯板：core material
20、催化板材：catalyzed board ,coated catalyzed laminate
21、涂膠催化層壓板：adhesive-coated catalyzed laminate
22、涂膠無(wú)催層壓板：adhesive-coated uncatalyzed laminate
23、粘結(jié)層：bonding layer
24、粘結(jié)膜：film adhesive
25、涂膠粘劑絕緣薄膜：adhesive coated dielectric film
26、無(wú)支撐膠粘劑膜：unsupported adhesive film
27、覆蓋層：cover layer (cover lay)
28、增強(qiáng)板材：stiffener material
29、銅箔面：copper-clad surface
30、去銅箔面：foil removal surface
31、層壓板面：unclad laminate surface
32、基膜面：base film surface
33、膠粘劑面：adhesive faec
34、原始光潔面：plate finish
35、粗面：matt finish
36、縱向：length wise direction
37、模向：cross wise direction
38、剪切板：cut to size panel
39、酚醛紙質(zhì)覆銅箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
40、環(huán)氧紙質(zhì)覆銅箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
41、環(huán)氧玻璃布基覆銅箔板：epoxide woven glass fabric copper-clad laminates
42、環(huán)氧玻璃布紙復(fù)合覆銅箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
43、環(huán)氧玻璃布玻璃纖維復(fù)合覆銅箔板：epoxide non woven/woven glass reinforced copper-clad laminates
44、聚酯玻璃布覆銅箔板：ployester woven glass fabric copper-clad laminates
45、聚酰亞胺玻璃布覆銅箔板：polyimide woven glass fabric copper-clad laminates
46、雙馬來(lái)酰亞胺三嗪環(huán)氧玻璃布覆銅箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
47、環(huán)氧合成纖維布覆銅箔板：epoxide synthetic fiber fabric copper-clad laminates
48、聚四乙烯玻璃纖維覆銅箔板：teflon/fiber glass copper-clad laminates
49、超薄型層壓板：ultra thin laminate
50、陶瓷基覆銅箔板：ceramics base copper-clad laminates
51、紫外線阻擋型覆銅箔板：UV blocking copper-clad laminates
作者：ilww 2004-11-10 16:19:00)

三、基材的材料
1、 A階樹(shù)脂：A-stage resin
2、 B階樹(shù)脂：B-stage resin
3、 C階樹(shù)脂：C-stage resin
4、環(huán)氧樹(shù)脂：epoxy resin
5、酚醛樹(shù)脂：phenolic resin
6、聚酯樹(shù)脂：polyester resin
7、聚酰亞胺樹(shù)脂：polyimide resin
8、雙馬來(lái)酰亞胺三嗪樹(shù)脂：bismaleimide-triazine resin
9、丙烯酸樹(shù)脂：acrylic resin
10、三聚氰胺甲醛樹(shù)脂：melamine formaldehyde resin
11、多官能環(huán)氧樹(shù)脂：polyfunctional epoxy resin
12、溴化環(huán)氧樹(shù)脂：brominated epoxy resin
13、環(huán)氧酚醛：epoxy novolac
14、氟樹(shù)脂：fluroresin
15、硅樹(shù)脂：silicone resin
16、硅烷：silane
17、聚合物：polymer
18、無(wú)定形聚合物：amorphous polymer
19、結(jié)晶現(xiàn)象：crystalline polamer
20、雙晶現(xiàn)象：dimorphism
21、共聚物：copolymer
22、合成樹(shù)脂：synthetic
23、熱固性樹(shù)脂：thermosetting resin
24、熱塑性樹(shù)脂：thermoplastic resin
25、感旋光性樹(shù)脂：photosensitive resin
26、環(huán)氧當(dāng)量：weight per epoxy equivalent (WPE)
27、環(huán)氧值：epoxy value
28、雙氰胺：dicyandiamide
29、粘結(jié)劑：binder
30、膠粘劑：adesive
31、固化劑：curing agent
32、阻燃劑：flame retardant
33、遮光劑：opaquer
34、增塑劑：plasticizers
35、不飽和聚酯：unsatuiated polyester
36、聚酯薄膜：polyester
37、聚酰亞胺薄膜：polyimide film (PI)
38、聚四氟乙烯：polytetrafluoetylene (PTFE)
39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)
40、增強(qiáng)材料：reinforcing material
41、玻璃纖維：glass fiber
42、 E玻璃纖維：E-glass fibre
43、 D玻璃纖維：D-glass fibre
44、 S玻璃纖維：S-glass fibre
45、玻璃布：glass fabric
46、非織布：non-woven fabric
47、玻璃纖維墊：glass mats
48、紗線：yarn
49、單絲：filament
50、絞股：strand
51、緯紗：weft yarn
52、經(jīng)紗：warp yarn
53、但尼爾：denier
54、經(jīng)向：warp-wise
55、緯向：weft-wise, filling-wise
56、織物經(jīng)緯密度：thread count
57、織物組織：weave structure
58、平紋組織：plain structure
59、壞布：grey fabric
60、稀松織物：woven scrim
61、弓緯：bow of weave
62、斷經(jīng)：end missing
63、缺緯：mis-picks
64、緯斜：bias
65、折痕：crease
66、云織：waviness
67、魚眼：fish eye
68、毛圈長(zhǎng)：feather length
69、厚薄段：mark
70、裂縫：split
71、捻度：twist of yarn
72、浸潤(rùn)劑含量：size content
73、浸潤(rùn)劑殘留量：size residue
74、處理劑含量：finish level
75、浸潤(rùn)劑：size
76、偶聯(lián)劑：couplint agent
77、處理織物：finished fabric
78、聚酰胺纖維：polyarmide fiber
79、聚酯纖維非織布：non-woven polyester fabric
80、浸漬絕緣縱紙：impregnating insulation paper
81、聚芳酰胺纖維紙：aromatic polyamide paper
82、斷裂長(zhǎng)：breaking length
83、吸水高度：height of capillary rise
84、濕強(qiáng)度保留率：wet strength retention
85、白度：whitenness
86、陶瓷：ceramics
87、導(dǎo)電箔：conductive foil
88、銅箔：copper foil
89、電解銅箔：electrodeposited copper foil (ED copper foil)
90、壓延銅箔：rolled copper foil
91、退火銅箔：annealed copper foil
92、壓延退火銅箔：rolled annealed copper foil (RA copper foil)
93、薄銅箔：thin copper foil
94、涂膠銅箔：adhesive coated foil
95、涂膠脂銅箔：resin coated copper foil (RCC)
96、復(fù)合金屬箔：composite metallic material
97、載體箔：carrier foil
98、殷瓦：invar
99、箔（剖面）輪廓：foil profile
100、光面：shiny side
101、粗糙面：matte side
102、處理面：treated side
103、防銹處理：stain proofing
104、雙面處理銅箔：double treated foil
作者：ilww 2004-11-10 16:20:00)

四、設(shè)計(jì)
1、原理圖：shematic diagram
2、邏輯圖：logic diagram
3、印制線路布設(shè)：printed wire layout
4、布設(shè)總圖：master drawing
5、可制造性設(shè)計(jì)：design-for-manufacturability
6、計(jì)算機(jī)輔助設(shè)計(jì)：computer-aided design.(CAD)
7、計(jì)算機(jī)輔助制造：computer-aided manufacturing.(CAM)
8、計(jì)算機(jī)集成制造：computer integrat manufacturing.(CIM)
9、計(jì)算機(jī)輔助工程：computer-aided engineering.(CAE)
10、計(jì)算機(jī)輔助測(cè)試：computer-aided test.(CAT)
11、電子設(shè)計(jì)自動(dòng)化：electric design automation .(EDA)
12、工程設(shè)計(jì)自動(dòng)化：engineering design automaton .(EDA2)
13、組裝設(shè)計(jì)自動(dòng)化：assembly aided architectural design. (AAAD)
14、計(jì)算機(jī)輔助制圖：computer aided drawing
15、計(jì)算機(jī)控制顯示：computer controlled display .(CCD)
16、布局：placement
17、布線：routing
18、布圖設(shè)計(jì)：layout
19、重布：rerouting
20、模擬：simulation
21、邏輯模擬：logic simulation
22、電路模擬：circit simulation
23、時(shí)序模擬：timing simulation
24、模塊化：modularization
25、布線完成率：layout effeciency
26、機(jī)器描述格式：machine descriptionm format .(MDF)
27、機(jī)器描述格式數(shù)據(jù)庫(kù)：MDF databse
28、設(shè)計(jì)數(shù)據(jù)庫(kù)：design database
29、設(shè)計(jì)原點(diǎn)：design origin
30、優(yōu)化（設(shè)計(jì)）：optimization (design)
31、供設(shè)計(jì)優(yōu)化坐標(biāo)軸：predominant axis
32、表格原點(diǎn)：table origin
33、鏡像：mirroring
34、驅(qū)動(dòng)文件：drive file
35、中間文件：intermediate file
36、制造文件：manufacturing documentation
37、隊(duì)列支撐數(shù)據(jù)庫(kù)：queue support database
38、組件安置：component positioning
39、圖形顯示：graphics dispaly
40、比例因子：scaling factor
41、掃描填充：scan filling
42、矩形填充：rectangle filling
43、填充域：region filling
44、實(shí)體設(shè)計(jì)：physical design
45、邏輯設(shè)計(jì)：logic design
46、邏輯電路：logic circuit
47、層次設(shè)計(jì)：hierarchical design
48、自頂向下設(shè)計(jì)：top-down design
49、自底向上設(shè)計(jì)：bottom-up design
50、線網(wǎng)：net
51、數(shù)字化：digitzing
52、設(shè)計(jì)規(guī)則檢查：design rule checking
53、走（布）線器：router (CAD)
54、網(wǎng)絡(luò)表：net list
55、計(jì)算機(jī)輔助電路分析：computer-aided circuit analysis
56、子線網(wǎng)：subnet
57、目標(biāo)函數(shù)：objective function
58、設(shè)計(jì)后處理：post design processing (PDP)
59、交互式制圖設(shè)計(jì)：interactive drawing design
60、費(fèi)用矩陣：cost metrix
61、工程圖：engineering drawing
62、方塊框圖：block diagram
63、迷宮：moze
64、組件密度：component density
65、巡回售貨員問(wèn)題：traveling salesman problem
66、自由度：degrees freedom
67、入度：out going degree
68、出度：incoming degree
69、曼哈頓距離：manhatton distance
70、歐幾里德距離：euclidean distance
71、網(wǎng)絡(luò)：network
72、陣列：array
73、段：segment
74、邏輯：logic
75、邏輯設(shè)計(jì)自動(dòng)化：logic design automation
76、分線：separated time
77、分層：separated layer
78、定順序：definite sequenc
作者：ilww 2004-11-10 16:21:00)

五、形狀與尺寸：
1、導(dǎo)線（信道）：conduction (track)
2、導(dǎo)線（體）寬度：conductor width
3、導(dǎo)線距離：conductor spacing
4、導(dǎo)線層：conductor layer
5、導(dǎo)線寬度/間距：conductor line/space
6、第一導(dǎo)線層：conductor layer No.1
7、圓形盤：round pad
8、方形盤：square pad
9、菱形盤：diamond pad
10、長(zhǎng)方形焊盤：oblong pad
11、子彈形盤：bullet pad
12、淚滴盤：teardrop pad
13、雪人盤：snowman pad
14、 V形盤：V-shaped pad
15、環(huán)形盤：annular pad
16、非圓形盤：non-circular pad
17、隔離盤：isolation pad
18、非功能連接盤：monfunctional pad
19、偏置連接盤：offset land
20、腹（背）裸盤：back-bard land
21、盤址：anchoring spaur
22、連接盤圖形：land pattern
23、連接盤網(wǎng)格陣列：land grid array
24、孔環(huán)：annular ring
25、組件孔：component hole
26、安裝孔：mounting hole
27、支撐孔：supported hole
28、非支撐孔：unsupported hole
29、導(dǎo)通孔：via
30、鍍通孔：plated through hole (PTH)
31、余隙孔：access hole
32、盲孔：blind via (hole)
33、埋孔：buried via hole
34、埋/盲孔：buried /blind via
35、任意層內(nèi)部導(dǎo)通孔：any layer inner via hole (ALIVH)
36、全部鉆孔：all drilled hole
37、定位孔：toaling hole
38、無(wú)連接盤孔：landless hole
39、中間孔：interstitial hole
40、無(wú)連接盤導(dǎo)通孔：landless via hole
41、引導(dǎo)孔：pilot hole
42、端接全隙孔：terminal clearomee hole
43、準(zhǔn)表面間鍍覆孔：quasi-interfacing plated-through hole
44、準(zhǔn)尺寸孔：dimensioned hole
45、在連接盤中導(dǎo)通孔：via-in-pad
46、孔位：hole location
47、孔密度：hole density
48、孔圖：hole pattern
49、鉆孔圖：drill drawing
50、裝配圖：assembly drawing
51、印制板組裝圖：printed board assembly drawing
52、參考基準(zhǔn)：datum referan

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